US Patent Issued to Zhuhai ACCESS Semiconductor on June 9 for "Packaging structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,053, issued on June 9, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China). "Packaging structure and manufacturing method... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Chip-on-film semiconductor package and display apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,054, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Chip-on-film semiconductor package and display... Read More

US Patent Issued to DENSO on June 9 for "Power control apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,055, issued on June 9, was assigned to DENSO Corp. (Kariya, Japan). "Power control apparatus" was invented by Shintaro Kogure (Kariya-city, ... Read More

US Patent Issued to Kulicke and Soffa Industries on June 9 for "Bonding systems for bonding a semiconductor element to a substrate, and related methods" (Pennsylvania Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,056, issued on June 9, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Bonding systems for bonding a semiconducto... Read More

US Patent Issued to SHINKO ELECTRIC INDUSTRIES on June 9 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,057, issued on June 9, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Semiconductor device" was invented by Kei Muray... Read More

US Patent Issued to NANYA TECHNOLOGY on June 9 for "Semiconductor device structure including a bonding structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,059, issued on June 9, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device structure including a bonding... Read More

US Patent Issued to NITTO DENKO on June 9 for "Resin composition for encapsulating light-emitting device, light source unit, and method for manufacturing light source unit" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,060, issued on June 9, was assigned to NITTO DENKO Corp. (Ibaraki, Japan). "Resin composition for encapsulating light-emitting device, light... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Package structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,061, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of manuf... Read More

US Patent Issued to UTAC Headquarters on June 9 for "Semiconductor packages and methods of forming RDL and side and back protection for semiconductor device" (Singaporean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,062, issued on June 9, was assigned to UTAC Headquarters Pte. Ltd. (Singapore). "Semiconductor packages and methods of forming RDL and side ... Read More

US Patent Issued to Intel on June 9 for "Hermetic seal for transistors with metal on both sides" (Oregon Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,063, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.). "Hermetic seal for transistors with metal on both sides" was inven... Read More

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