US Patent Issued to UTAC Headquarters on June 9 for "Semiconductor packages and methods of forming RDL and side and back protection for semiconductor device" (Singaporean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,062, issued on June 9, was assigned to UTAC Headquarters Pte. Ltd. (Singapore).

"Semiconductor packages and methods of forming RDL and side and back protection for semiconductor device" was invented by Il Kwon Shim (Singapore), Ronnie M. De Villa (Singapore) and Dzafir Bin Mohd Shariff (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and a first insulating layer formed over a first major surface of the substrate. A first redistribution layer is formed over the first insulating layer. A second insulating layer is formed over the first redistribution layer. A second redistribution layer can be formed over...