US Patent Issued to NITTO DENKO on June 9 for "Resin composition for encapsulating light-emitting device, light source unit, and method for manufacturing light source unit" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,060, issued on June 9, was assigned to NITTO DENKO Corp. (Ibaraki, Japan).

"Resin composition for encapsulating light-emitting device, light source unit, and method for manufacturing light source unit" was invented by Naoya Sugimoto (Osaka, Japan) and Shoichi Kawamitsu (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a resin composition for producing an encapsulating member having high heat resistance and high encapsulation performance. In the resin composition for encapsulating a light-emitting device according to the present invention, at least one of (i) and (ii) is satisfied: (i) the resin composition in...