US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Chip-on-film semiconductor package and display apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,054, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Chip-on-film semiconductor package and display apparatus including the same" was invented by Seunghyun Cho (Suwon-si, South Korea) and Jaemin Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip-on-film (COF) semiconductor package includes: a main film substrate having at least two module attachment regions spaced apart from each other; at least two sub-modules respectively attached to the at least two module attachment regions and spaced apart from each other on the main film substrate, wherein each of the at least two sub-modul...