US Patent Issued to Intel on Sept. 22 for "Dam surrounding a die on a substrate" (Arizona, New Mexico, California Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,668, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Dam surrounding a die on a substrate" was invented by Liang H... Read More

US Patent Issued to Intel on Sept. 22 for "Protective coating on an edge of a glass core" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,669, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Protective coating on an edge of a glass core" was invented b... Read More

US Patent Issued to ELTA SYSTEMS on Sept. 22 for "Encapsulation techniques" (Israeli Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,670, issued on Sept. 22, was assigned to ELTA SYSTEMS LTD. (Lod, Israel). "Encapsulation techniques" was invented by Itzhak Shapir (Haifa,... Read More

US Patent Issued to Samsung Display on Sept. 22 for "Display device having first and second organic planarization layers with respective first and second openings therein that are not aligned with each other and expose a conductive pattern" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,671, issued on Sept. 22, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device having first and second organi... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Semiconductor structure with integrated passive device having opposed solder bumps" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,672, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure with inte... Read More

US Patent Issued to Shanghai Tianma Micro-Electronics on Sept. 22 for "LED module, LED source substrate, display panel, and display apparatus" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,673, issued on Sept. 22, was assigned to Shanghai Tianma Micro-Electronics Co. Ltd. (Shanghai). "LED module, LED source substrate, display... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor package having a plurality of semiconductor chips stacked on a semiconductor substrate" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,674, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having a plurality o... Read More

US Patent Issued to ETRON TECHNOLOGY on Sept. 22 for "Memory module with reduced bonding wires" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,675, issued on Sept. 22, was assigned to ETRON TECHNOLOGY INC. (Hsinchu, Taiwan). "Memory module with reduced bonding wires" was invented ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Substrate for semiconductor package and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,676, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Substrate for semiconductor package and se... Read More

US Patent Issued to Bridgelux on Sept. 22 for "Color-temperature-tunable lighting devices" (Chinese, American Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,677, issued on Sept. 22, was assigned to Bridgelux Inc. (Fremont, Calif.). "Color-temperature-tunable lighting devices" was invented by Ji... Read More

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