US Patent Issued to ETRON TECHNOLOGY on Sept. 22 for "Memory module with reduced bonding wires" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,675, issued on Sept. 22, was assigned to ETRON TECHNOLOGY INC. (Hsinchu, Taiwan).

"Memory module with reduced bonding wires" was invented by Chun Shiah (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a memory module, comprising a first memory die with a first surface and a third surface opposite to the first surface, wherein a first redistribution layer and a first original pad set are formed over the first surface; a second memory die with a second surface and a fourth surface opposite to the second surface, wherein a second original pad set are formed over the second surface; a wire bonding pad set disp...