US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Substrate for semiconductor package and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,676, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Substrate for semiconductor package and semiconductor package including the same" was invented by Seongho Yoon (Suwon-si, South Korea) and Sang Sub Song (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate for a semiconductor package includes a semiconductor chip mounting region; a bonding terminal region including at least one bonding terminal; at least one plating line extending across the semiconductor chip mounting region; a plating line prohibition region at an opposite side of the bonding terminal region from the semico...