US Patent Issued to International Business Machines on May 26 for "Backside contact that reduces risk of contact to gate short" (New York, Vermont Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,842, issued on May 26, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Backside contact that reduces risk of contact ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Transistor stacks having spacers, and related fabrication methods" (New York Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,843, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Transistor stacks having spacers, and related ... Read More

US Patent Issued to International Business Machines on May 26 for "Shared source/drain contact for stacked field-effect transistor" (New York Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,844, issued on May 26, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Shared source/drain contact for stacked field-... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 26 for "Semiconductor contact structure including via structure with metal bulk layer nested within barrier liner and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,845, issued on May 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor contact structure inclu... Read More

US Patent Issued to FUJI ELECTRIC on May 26 for "Silicon carbide semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,846, issued on May 26, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Silicon carbide semiconductor device" was invented by Taka... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 26 for "Integrated circuit device and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,847, issued on May 26, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Integrated circuit device and manufac... Read More

US Patent Issued to FUJI ELECTRIC on May 26 for "Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,848, issued on May 26, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Silicon carbide semiconductor device and method of manufac... Read More

US Patent Issued to Applied Materials on May 26 for "Low temperature n-type contact EPI formation" (California Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,849, issued on May 26, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Low temperature n-type contact EPI formation" was inve... Read More

US Patent Issued to Intel on May 26 for "Lattice stack for internal spacer fabrication" (Oregon Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,850, issued on May 26, was assigned to Intel Corp. (Santa Clara, Calif.). "Lattice stack for internal spacer fabrication" was invented by Ch... Read More

US Patent Issued to NXP on May 26 for "Transistors with source-connected field plates" (Arizona Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,851, issued on May 26, was assigned to NXP B.V. (Eindhoven, Netherlands). "Transistors with source-connected field plates" was invented by C... Read More

• ««
• «
• 37759
• 37760
• 37761
• 37762
• 37763
• 37764
• 37765
• 37766
• 37767
• 37768
• »
• »»