US Patent Issued to SAMSUNG ELECTRONICS on June 2 for "Semiconductor package including buffer chip bonded to memory dies using wires" (South Korean Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,487, issued on June 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including buffer chip bo... Read More

US Patent Issued to UNITED MICROELECTRONICS on June 2 for "Semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,488, issued on June 2, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor device" was invented by Yu-Chun... Read More

US Patent Issued to SUMITOMO ELECTRIC DEVICE INNOVATIONS on June 2 for "Output matching network to reduce self and mutual inductances of output inductive components in a cavity package" (Texas Inventor)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,489, issued on June 2, was assigned to SUMITOMO ELECTRIC DEVICE INNOVATIONS INC. (Yokohama, Japan). "Output matching network to reduce self ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 2 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,490, issued on June 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Youngde... Read More

US Patent Issued to GM GLOBAL TECHNOLOGY OPERATIONS on June 2 for "Micro integrated circuit with integrated micro light-emitting diode display laminated into glass" (Michigan Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,492, issued on June 2, was assigned to GM GLOBAL TECHNOLOGY OPERATIONS LLC (Detroit). "Micro integrated circuit with integrated micro light-... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 2 for "Semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,493, issued on June 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of ma... Read More

US Patent Issued to AUO on June 2 for "Light emitting component array substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,494, issued on June 2, was assigned to AUO Corp. (Hsin-Chu, Taiwan). "Light emitting component array substrate" was invented by Wen-Hsien Ts... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 2 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,495, issued on June 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and manufacturing m... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 2 for "Package structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,496, issued on June 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of formi... Read More

US Patent Issued to MediaTek on June 2 for "Semiconductor package using substrate block integration" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,497, issued on June 2, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor package using substrate block integration" was i... Read More

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