US Patent Issued to Taiwan Semiconductor Manufacturing on June 2 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,495, issued on June 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and manufacturing method thereof" was invented by Chuei-Tang Wang (Taichung City, Taiwan), Chung-Hao Tsai (Changhua County, Taiwan), Chen-Hua Yu (Hsinchu City, Taiwan) and Tzu-Chun Tang (Kaohsiung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a semiconductor die, an antenna substrate structure, a redistribution layer. The semiconductor die laterally encapsulated by a first encapsulant. The antenna substrate structure disposed over the semiconductor die, wherein the antenna substrate struct...