ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,489, issued on June 2, was assigned to SUMITOMO ELECTRIC DEVICE INNOVATIONS INC. (Yokohama, Japan).

"Output matching network to reduce self and mutual inductances of output inductive components in a cavity package" was invented by Seiya Takashima (Coppell, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a cavity package including a substrate and at least one output lead disposed higher than the substrate, in a side view, to create a cavity. A transistor die is disposed within the cavity. A top surface of the transistor die is lower than a top surface of the output lead when viewed in the side view. A first substra...