US Patent Issued to SAMSUNG ELECTRONICS on June 2 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,490, issued on June 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Youngdeuk Kim (Suwon-si, South Korea) and Heejung Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate including a substrate cavity, the substrate cavity extending from an upper surface of the package substrate toward a lower surface of the package substrate, a wiring interposer attached to the package substrate, a memory semiconductor structure attached to a lower surface of the wiring interposer, at least a portion of the memory semiconductor ...