US Patent Issued to Allegro MicroSystems on May 26 for "Packaged current sensor integrated circuit with exposed cooling pad" (German, American Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,009, issued on May 26, was assigned to Allegro MicroSystems LLC (Manchester, N.H.). "Packaged current sensor integrated circuit with exposed... Read More

US Patent Issued to Microsoft Technology Licensing on May 26 for "Fabrication method" (Dutch Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,010, issued on May 26, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "Fabrication method" was invented by Pavel Aseev... Read More

US Patent Issued to UNIVERSITEIT LEIDEN on May 26 for "Junction, device and methods of fabrication" (Dutch Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,011, issued on May 26, was assigned to UNIVERSITEIT LEIDEN (Leiden, Netherlands). "Junction, device and methods of fabrication" was invented... Read More

US Patent Issued to KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY on May 26 for "Memory device and memory apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,012, issued on May 26, was assigned to KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (Daejeon, South Korea). "Memory device and memory ... Read More

US Patent Issued to Tokyo Electron on May 26 for "Wafer bonding process with reduced overlay distortion" (New York, Texas Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,013, issued on May 26, was assigned to Tokyo Electron Ltd. (Tokyo). "Wafer bonding process with reduced overlay distortion" was invented by ... Read More

US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on May 26 for "Silicon carbide wafer manufacturing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,014, issued on May 26, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (N... Read More

US Patent Issued to Applied Materials on May 26 for "Methods of forming conformal transition metal dichalcogenide films for memory and logic applications" (Singaporean, American Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,015, issued on May 26, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods of forming conformal transition metal dichalco... Read More

US Patent Issued to The Government of the United States of America, as represented by the Secretary of the Navy on May 26 for "Diamond-capped gallium oxide transistor" (Virginia, Maryland Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,016, issued on May 26, was assigned to The Government of the United States of America, as represented by the Secretary of the Navy (Arlington... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 26 for "Semiconductor devices and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,017, issued on May 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices and methods of ... Read More

US Patent Issued to Micron Technology on May 26 for "Electronic devices comprising silicon carbide materials" (Idaho Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,018, issued on May 26, was assigned to Micron Technology Inc. (Boise, Idaho). "Electronic devices comprising silicon carbide materials" was ... Read More

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