US Patent Issued to Taiwan Semiconductor Manufacturing on May 26 for "Semiconductor devices and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,017, issued on May 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing thereof" was invented by Shu-Ling Liao (Taichung City, Taiwan), Te-En Cheng (Taoyuan City, Taiwan), Nai-Yu Yeh (Changhua City, Taiwan), Ming-Han Chung (Hsinchu City, Taiwan), Chunyao Wang (Zhubei City, Taiwan) and Yung-Cheng Lu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Fabrication of semiconductor devices is provided. A chamber is evacuated to a pressure of less than about 1 Torr. The chamber is heated to a temperature in excess of about 400deg C. A precursor is introduced...