US Patent Issued to QUALCOMM on April 21 for "Integrated circuit (IC) package employing a metal block with metal interconnects thermally coupling a die to an interposer substrate for dissipating thermal energy of the die, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,869, issued on April 21, was assigned to QUALCOMM Inc. (San Diego). "Integrated circuit (IC) package employing a metal block with metal in... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,870, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure and manuf... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Through-dielectric vias for direct connection and method forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,871, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Through-dielectric vias for direc... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,873, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Integrated circuit package and me... Read More

US Patent Issued to SHINKO ELECTRIC INDUSTRIES, SHINSHU UNIVERSITY on April 21 for "Connection structural body with Cu-Cu bonding and roughened surface deposits" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,874, issued on April 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan) and SHINSHU UNIVERSITY (Matsumoto City, Japan)... Read More

US Patent Issued to Wistron NeWeb on April 21 for "Package structure having second adhesive between side surface of semiconductor package and first adhesive" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,875, issued on April 21, was assigned to Wistron NeWeb Corp. (Hsinchu, Taiwan). "Package structure having second adhesive between side sur... Read More

US Patent Issued to Nokia Solutions and Networks on April 21 for "Methods, apparatuses, and computer readable media for controlling downlink transmissions in integrated access and backhaul network" (Finnish, Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,303, issued on April 21, was assigned to Nokia Solutions and Networks Oy (Espoo, Finland). "Methods, apparatuses, and computer readable me... Read More

US Patent Issued to AT&T Intellectual Property I, AT&T Communications Services India on April 21 for "Dynamic integrated access and backhaul for wireless networks" (American, Indian Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,304, issued on April 21, was assigned to AT&T Intellectual Property I LP (Atlanta) and AT&T Communications Services India Private Ltd. (Kar... Read More

US Patent Issued to SAUDI ARABIAN OIL on April 21 for "Grade of service optimization for a telecommunications network" (Saudi Arabia Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,305, issued on April 21, was assigned to SAUDI ARABIAN OIL COMPANY (Dhahran, Saudi Arabia). "Grade of service optimization for a telecommu... Read More

US Patent Issued to BEIJING XIAOMI MOBILE SOFTWARE on April 21 for "Configuration information transmission method, communication device" (Chinese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,306, issued on April 21, was assigned to BEIJING XIAOMI MOBILE SOFTWARE Co. LTD. (Beijing). "Configuration information transmission method... Read More

• ««
• «
• 2818
• 2819
• 2820
• 2821
• 2822
• 2823
• 2824
• 2825
• 2826
• 2827
• »
• »»