US Patent Issued to NGK INSULATORS, NGK ADREC on June 16 for "Method of manufacturing Si-SiC-based composite structure" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,531, issued on June 16, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan) and NGK ADREC Co. LTD. (Mitake Cho, Japan). "Method of manufact... Read More

US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, UNIVERSITE GRENOBLE ALPES on June 16 for "Method for producing a dielectric layer on a structure made of materials III-V" (French Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,532, issued on June 16, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris), CENTRE NATIONAL DE LA RECHER... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 16 for "High-k isolation of fin structures" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,533, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "High-k isolation of fin structu... Read More

US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies, HAMAMATSU PHOTONICS on June 16 for "Method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,534, issued on June 16, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan), MIRISE Technologies Corp. (Ni... Read More

US Patent Issued to Semes on June 16 for "Substrate treating apparatus and substrate treating method" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,535, issued on June 16, was assigned to Semes Co. LTD (Cheonan-si, South Korea). "Substrate treating apparatus and substrate treating metho... Read More

US Patent Issued to Tokyo Electron on June 16 for "Systems and methods for semiconductor etching" (New York Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,536, issued on June 16, was assigned to Tokyo Electron Ltd. (Tokyo). "Systems and methods for semiconductor etching" was invented by Du Zha... Read More

US Patent Issued to Applied Materials on June 16 for "Etching methods for reducing micro and macro scalloping on sidewalls of etched features of semiconductor devices" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,537, issued on June 16, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Etching methods for reducing micro and macro scallop... Read More

US Patent Issued to NANYA TECHNOLOGY on June 16 for "Method of manufacturing semiconductor device for reducing defect in array region" (Taiwanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,538, issued on June 16, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Method of manufacturing semiconductor device for... Read More

US Patent Issued to APPLIED MATERIALS on June 16 for "Apparatus for removing etch stop layers" (California, Oregon Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,539, issued on June 16, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.). "Apparatus for removing etch stop layers" was invente... Read More

US Patent Issued to L'Air Liquide Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude on June 16 for "Etching method using oxygen-containing hydrofluorocarbon" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,540, issued on June 16, was assigned to L'Air Liquide Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude (Paris). "... Read More

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