US Patent Issued to Applied Materials on May 5 for "Remote surface wave propagation for semiconductor chambers" (California Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,553, issued on May 5, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Remote surface wave propagation for semiconductor chambe... Read More

US Patent Issued to Tokyo Electron on May 5 for "Plasma processing with phase-locked waveforms" (New York Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,554, issued on May 5, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing with phase-locked waveforms" was invented by Pingshan L... Read More

US Patent Issued to Tokyo Electron on May 5 for "Systems and methods for plasma process" (Texas Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,555, issued on May 5, was assigned to Tokyo Electron Ltd. (Tokyo). "Systems and methods for plasma process" was invented by Charles Schlechte... Read More

US Patent Issued to HITACHI HIGH-TECH on May 5 for "Plasma processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,556, issued on May 5, was assigned to HITACHI HIGH-TECH Corp. (Tokyo). "Plasma processing apparatus" was invented by Tetsuo Kawanabe (Tokyo),... Read More

US Patent Issued to Tokyo Electron on May 5 for "Plasma processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,557, issued on May 5, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus" was invented by Syouji Yamagishi (Nirasaki, ... Read More

US Patent Issued to SEMES on May 5 for "Apparatus for processing substrate and method of processing substrate" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,558, issued on May 5, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Apparatus for processing substrate and method of proc... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 5 for "Gas supply device and plasma processing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,559, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Gas supply device and plasma processing apparatu... Read More

US Patent Issued to PSK on May 5 for "Apparatus for treating substrate and method for aligning dielectric plate using the same" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,560, issued on May 5, was assigned to PSK INC. (Hwaseong-si, South Korea). "Apparatus for treating substrate and method for aligning dielectr... Read More

US Patent Issued to Tokyo Electron on May 5 for "Plasma processing apparatus and plasma processing method" (Japanese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,561, issued on May 5, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus and plasma processing method" was invented by... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 5 for "Focus ring for a plasma-based semiconductor processing tool" (Taiwanese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,562, issued on May 5, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Focus ring for a plasma-based semicondu... Read More

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