US Patent Issued to NANYA TECHNOLOGY on May 26 for "Semiconductor device and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,773, issued on May 26, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device and method for manufacturing ... Read More

US Patent Issued to NANYA TECHNOLOGY on May 26 for "Memory cell with improved insulating structure and method of manufacturing thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,774, issued on May 26, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Memory cell with improved insulating structure and... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Semiconductor memory device" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,775, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor memory device" was invented b... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Semiconductor device including channel pattern and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,776, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device including channel patt... Read More

US Patent Issued to NANYA TECHNOLOGY on May 26 for "Memory device with air gap and method for preparing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,777, issued on May 26, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Memory device with air gap and method for preparin... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Semiconductor devices including a contact plug structure on a metal silicide layer" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,778, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices including a contact plug... Read More

US Patent Issued to Winbond Electronics on May 26 for "Memory device and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,779, issued on May 26, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Memory device and method of forming the same" was... Read More

US Patent Issued to Winbond Electronics on May 26 for "Three-dimensional flash memory device and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,780, issued on May 26, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Three-dimensional flash memory device and method ... Read More

US Patent Issued to Yangtze Memory Technologies on May 26 for "Three-dimensional NAND memory device and method of forming the same" (Chinese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,781, issued on May 26, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Three-dimensional NAND memory device and method... Read More

US Patent Issued to Micron Technology on May 26 for "Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells" (Idaho Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,782, issued on May 26, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory arrays comprising strings of memory cells and methods ... Read More

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