US Patent Issued to Mitsubishi Electric on April 21 for "Semiconductor device and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,830, issued on April 21, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method for manufacturing semiconduct... Read More

US Patent Issued to DENSO on April 21 for "Semiconductor device and semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,831, issued on April 21, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device and semiconductor module" was invented by... Read More

US Patent Issued to STMICROELECTRONICS on April 21 for "Packaged high voltage MOSFET device with connection clip and manufacturing process thereof" (Italian Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,832, issued on April 21, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy). "Packaged high voltage MOSFET device with conn... Read More

US Patent Issued to PIERBURG on April 21 for "Power semiconductor package" (German, American Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,833, issued on April 21, was assigned to PIERBURG GMBH (Neuss, Germany). "Power semiconductor package" was invented by Mika Nuotio (San Jo... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Semiconductor device package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,834, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device package ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Interposer substrate, package structure and manufacturing method of package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,835, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interposer substrate, package str... Read More

US Patent Issued to ROHM on April 21 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,836, issued on April 21, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Yusuke Harada (Kyoto, Japan)... Read More

US Patent Issued to LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) on April 21 for "Laterally mounted and packaged structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,837, issued on April 21, was assigned to LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD. (Kunshan City, China). "Laterally mounted and packa... Read More

US Patent Issued to PHOENIX PIONEER TECHNOLOGY on April 21 for "Component-embedded packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,838, issued on April 21, was assigned to PHOENIX PIONEER TECHNOLOGY Co. LTD. (Hsinchu County, Taiwan). "Component-embedded packaging struc... Read More

US Patent Issued to Micron Technology on April 21 for "Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same" (California, Idaho Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,839, issued on April 21, was assigned to Micron Technology Inc. (Boise, Idaho). "Packaged microelectronic devices having stacked interconn... Read More

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