ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,318, issued on June 16, was assigned to GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY Co. LTD. (Guangzhou, China). ... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,319, issued on June 16, was assigned to Wuhan Tianma Microelectronics Co. Ltd. (Wuhan, China). "Array substrate and preparation method ther... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,320, issued on June 16, was assigned to LG DISPLAY Co. LTD. (Seoul, South Korea). "Thin film transistor array substate and display device i... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,321, issued on June 16, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device" was invented by Jongchul Yoon (... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,322, issued on June 16, was assigned to Beijing BOE Optoelectronics Technology Co. Ltd. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,323, issued on June 16, was assigned to INNOLUX Corp. (Miao-Li County, Taiwan). "Electronic device" was invented by Hsi-Chia Wu (Miao-Li Co... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,324, issued on June 16, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Lateral capacitors of semiconductor devices" was invented... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,325, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Stacked multi-gate device with ... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,326, issued on June 16, was assigned to Monolithic 3D Inc. (Allen, Texas). "Methods to process 3D semiconductor devices and structures whic... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,327, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.). "Different poly pitches for advanced integrated circuit structur... Read More