US Patent Issued to Intel on June 16 for "Different poly pitches for advanced integrated circuit structure fabrication" (Oregon Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,327, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Different poly pitches for advanced integrated circuit structure fabrication" was invented by Ahmet Tura (Portland, Ore.) and Steven G. Jaloviar (Banks, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of logic gate structures having a first pitch between adjacent ones of the first ...