US Patent Issued to Applied Materials on May 12 for "Magnetic sensor assembly for a substrate process station" (German Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,612, issued on May 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Magnetic sensor assembly for a substrate process stati... Read More

US Patent Issued to SEMES on May 12 for "Transport vehicle cleaning device and article transport equipment including the same" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,613, issued on May 12, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Transport vehicle cleaning device and article transport eq... Read More

US Patent Issued to Tokyo Electron on May 12 for "Bonding apparatus, bonding system, and bonding method" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,614, issued on May 12, was assigned to Tokyo Electron Ltd. (Tokyo). "Bonding apparatus, bonding system, and bonding method" was invented by ... Read More

US Patent Issued to ENKRIS SEMICONDUCTOR on May 12 for "Semiconductor structure" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,615, issued on May 12, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China). "Semiconductor structure" was invented by Kai Liu (Suzhou,... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Wafer chuck table and wafer chuck system" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,616, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Wafer chuck table and wafer chuck system" was ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Wafer chuck including self-sealing vacuum seal assemblies and methods for operating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,617, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Wafer chuck including self-sealing va... Read More

US Patent Issued to POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION on May 12 for "Apparatus and method for setting semiconductor parameter" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,618, issued on May 12, was assigned to POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION (Pohang-si, South Korea). "Apparatus and method ... Read More

US Patent Issued to LG DISPLAY on May 12 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,619, issued on May 12, was assigned to LG DISPLAY Co. LTD. (Seoul, South Korea). "Display device" was invented by Seeun Kim (Seoul, South Ko... Read More

US Patent Issued to Meta Platforms on May 12 for "Die level integrated connection test circuit and method therefor" (California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,620, issued on May 12, was assigned to Meta Platforms Inc. (Menlo Park, Calif.). "Die level integrated connection test circuit and method th... Read More

US Patent Issued to NANYA TECHNOLOGY on May 12 for "Semiconductor structure and method of overlay measurement of semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,621, issued on May 12, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of overlay meas... Read More

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