US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 21 for "Printed circuit board and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,462, issued on April 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board and method of ... Read More

US Patent Issued to Mitsubishi Materials on April 21 for "Copper base substrate comprising an insulating layer having a specific relationship between thickness and elastic modulus" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,463, issued on April 21, was assigned to Mitsubishi Materials Corp. (Tokyo). "Copper base substrate comprising an insulating layer having ... Read More

US Patent Issued to Micron Technology on April 21 for "PCB land pad for three-pin MOSFET component" (Idaho Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,464, issued on April 21, was assigned to Micron Technology Inc. (Boise, Idaho). "PCB land pad for three-pin MOSFET component" was invented... Read More

US Patent Issued to SHINKO ELECTRIC INDUSTRIES on April 21 for "Wiring board" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,465, issued on April 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Wiring board" was invented by Hiroshi Yokot... Read More

US Patent Issued to Advanced Semiconductor Engineering on April 21 for "Circuit structure" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,466, issued on April 21, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Circuit structure" was invented by ... Read More

US Patent Issued to TAIWAN ALPHA ELECTRONIC on April 21 for "Spliced pressure sensing device and splicable pressure sensing unit thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,467, issued on April 21, was assigned to TAIWAN ALPHA ELECTRONIC Co. LTD. (Taoyuan City, Taiwan). "Spliced pressure sensing device and spl... Read More

US Patent Issued to Samsung SDI on April 21 for "Hybrid circuit board and battery pack having same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,468, issued on April 21, was assigned to Samsung SDI Co. Ltd. (Yongin-si, South Korea). "Hybrid circuit board and battery pack having same... Read More

US Patent Issued to HUIZHOU VISION NEW TECHNOLOGY on April 21 for "Integrated module and intelligent device" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,469, issued on April 21, was assigned to HUIZHOU VISION NEW TECHNOLOGY Co. LTD. (Huizhou, China). "Integrated module and intelligent devic... Read More

US Patent Issued to Innolux on April 21 for "Electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,470, issued on April 21, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Electronic device" was invented by Chin-Lung Ting (Miaoli... Read More

US Patent Issued to Vicor on April 21 for "Panel-molded electronic assemblies" (Massachusetts, California, New Hampshire Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,471, issued on April 21, was assigned to Vicor Corp. (Andover, Mass.). "Panel-molded electronic assemblies" was invented by Patrizio Vinci... Read More

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