US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 21 for "Printed circuit board and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,462, issued on April 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board and method of manufacturing the same" was invented by Sang Min Ahn (Suwon-si, South Korea) and Gyoo Tae Bae (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a glass layer having a first side surface and a second side surface, opposing each other in a first direction, a third side surface and a fourth side surface, opposing each other in a second direction, a first corner portion connecting the first side surface and the third side surface to each other, a second corner port...