US Patent Issued to Mitsubishi Materials on April 21 for "Copper base substrate comprising an insulating layer having a specific relationship between thickness and elastic modulus" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,463, issued on April 21, was assigned to Mitsubishi Materials Corp. (Tokyo).

"Copper base substrate comprising an insulating layer having a specific relationship between thickness and elastic modulus" was invented by Fumiaki Ishikawa (Saitama, Japan) and Shintaro Hara (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: micro metre) to an elastic modulus (unit: GPa) at 100deg C. is 50 or more in the insulating layer, and the circuit layer h...