US Patent Issued to Chengdu BOE Optoelectronics Technology, BOE Technology Group on April 21 for "Flexible circuit board, display panel and method for manufacturing same, and display device" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,456, issued on April 21, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Chengdu, China) and BOE Technology Group Co. Ltd.... Read More

US Patent Issued to MAGNOLIA WHITE on April 21 for "Stretchable device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,457, issued on April 21, was assigned to MAGNOLIA WHITE Corp. (Tokyo). "Stretchable device" was invented by Takumi Sano (Tokyo) and Masato... Read More

US Patent Issued to LG INNOTEK on April 21 for "Flexible printed circuit board, COF module, and electronic device comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,458, issued on April 21, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Flexible printed circuit board, COF module, and electr... Read More

US Patent Issued to NITTO DENKO on April 21 for "Method for producing wiring circuit board and wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,459, issued on April 21, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Method for producing wiring circuit board and wiring circuit b... Read More

US Patent Issued to GE PRECISION HEALTHCARE on April 21 for "Oil-air electrical feedthrough circuit board for high voltage generator" (French Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,460, issued on April 21, was assigned to GE PRECISION HEALTHCARE LLC (Waukesha, Wis.). "Oil-air electrical feedthrough circuit board for h... Read More

US Patent Issued to TOKUYAMA on April 21 for "Laminate for circuit board" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,461, issued on April 21, was assigned to TOKUYAMA Corp. (Shunan, Japan). "Laminate for circuit board" was invented by Eiki Tsushima (Chito... Read More

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 21 for "Printed circuit board and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,462, issued on April 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board and method of ... Read More

US Patent Issued to Mitsubishi Materials on April 21 for "Copper base substrate comprising an insulating layer having a specific relationship between thickness and elastic modulus" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,463, issued on April 21, was assigned to Mitsubishi Materials Corp. (Tokyo). "Copper base substrate comprising an insulating layer having ... Read More

US Patent Issued to Micron Technology on April 21 for "PCB land pad for three-pin MOSFET component" (Idaho Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,464, issued on April 21, was assigned to Micron Technology Inc. (Boise, Idaho). "PCB land pad for three-pin MOSFET component" was invented... Read More

US Patent Issued to SHINKO ELECTRIC INDUSTRIES on April 21 for "Wiring board" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,465, issued on April 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Wiring board" was invented by Hiroshi Yokot... Read More

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