US Patent Issued to Samsung SDI on May 12 for "Adhesive film, optical member comprising the same, and optical display apparatus comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,259, issued on May 12, was assigned to Samsung SDI Co. Ltd. (Yongin-si, South Korea). "Adhesive film, optical member comprising the same, an... Read More

US Patent Issued to Dow Silicones on May 12 for "Optically clear silicone acrylate adhesive composition" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,260, issued on May 12, was assigned to Dow Silicones Corp. (Midland, Mich.). "Optically clear silicone acrylate adhesive composition" was in... Read More

US Patent Issued to LINTEC on May 12 for "Adhesive for high-frequency dielectric heating, structure, and manufacturing method of structure" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,261, issued on May 12, was assigned to LINTEC Corp. (Tokyo). "Adhesive for high-frequency dielectric heating, structure, and manufacturing m... Read More

US Patent Issued to DDP SPECIALTY ELECTRONIC MATERIALS US on May 12 for "High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers" (Swiss Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,262, issued on May 12, was assigned to DDP SPECIALTY ELECTRONIC MATERIALS US LLC (Wilmington, Del.). "High modulus, toughened one-component ... Read More

US Patent Issued to HENKEL on May 12 for "Dimensionally stable, wipe-on, modified-polyether-polyurethane-based adhesive compound" (German Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,263, issued on May 12, was assigned to HENKEL AG & Co. KGaA (Duesseldorf, Germany). "Dimensionally stable, wipe-on, modified-polyether-polyu... Read More

US Patent Issued to Dow Silicones on May 12 for "Solventless pressure sensitive adhesive composition" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,264, issued on May 12, was assigned to Dow Silicones Corp. (Midland, Mich.). "Solventless pressure sensitive adhesive composition" was inven... Read More

US Patent Issued to ADEKA on May 12 for "Antistatic agent, antistatic composition comprising same, antistatic resin composition comprising same, and molded article thereof" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,265, issued on May 12, was assigned to ADEKA Corp. (Tokyo). "Antistatic agent, antistatic composition comprising same, antistatic resin comp... Read More

US Patent Issued to DAIKIN INDUSTRIES on May 12 for "Use of composition as refrigerant in compressor, compressor, and refrigeration cycle apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,266, issued on May 12, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan). "Use of composition as refrigerant in compressor, compressor, ... Read More

US Patent Issued to TEMPERATSURE on May 12 for "Semi-solid biodegradable refrigerant gel" (New York Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,268, issued on May 12, was assigned to TEMPERATSURE LLC (Wilmington, Del.). "Semi-solid biodegradable refrigerant gel" was invented by Benja... Read More

US Patent Issued to Shin-Etsu Chemical on May 12 for "Silicone composition and a thermally conductive silicone cured product having high thermal conductivity" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,270, issued on May 12, was assigned to Shin-Etsu Chemical Co. Ltd. (Tokyo). "Silicone composition and a thermally conductive silicone cured ... Read More

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