US Patent Issued to LINTEC on May 12 for "Adhesive for high-frequency dielectric heating, structure, and manufacturing method of structure" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,261, issued on May 12, was assigned to LINTEC Corp. (Tokyo).

"Adhesive for high-frequency dielectric heating, structure, and manufacturing method of structure" was invented by Koji Tsuchibuchi (Tokyo) and Naoki Taya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, ...