US Patent Issued to Shin-Etsu Chemical on May 12 for "Silicone composition and a thermally conductive silicone cured product having high thermal conductivity" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,270, issued on May 12, was assigned to Shin-Etsu Chemical Co. Ltd. (Tokyo).

"Silicone composition and a thermally conductive silicone cured product having high thermal conductivity" was invented by Yuya Hironaka (Annaka, Japan), Yasuhisa Ishihara (Annaka, Japan) and Katsuyuki Tanaka (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One of the objects the present invention to provide a cured product of a thermally conductive silicone composition having high thermal conductivity and excellent compressibility. A silicone composition comprising an organo(poly)siloxane and a thermally conductive filler, wherein the organo(poly)siloxane compris...