US Patent Issued to CANATU on April 14 for "Method of manufacturing a formed film" (Finnish Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,397, issued on April 14, was assigned to CANATU OY (Vantaa, Finland). "Method of manufacturing a formed film" was invented by Ilkka Varjos... Read More

US Patent Issued to CANATU on April 14 for "Method of manufacturing a formed film" (Finnish Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,397, issued on April 14, was assigned to CANATU OY (Vantaa, Finland). "Method of manufacturing a formed film" was invented by Ilkka Varjos... Read More

US Patent Issued to The Regents of the University of Colorado, a body corporate on April 14 for "Self-healable, recyclable, and reconfigurable wearable electronics device" (Colorado Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,398, issued on April 14, was assigned to The Regents of the University of Colorado, a body corporate (Denver). "Self-healable, recyclable,... Read More

US Patent Issued to The Regents of the University of Colorado, a body corporate on April 14 for "Self-healable, recyclable, and reconfigurable wearable electronics device" (Colorado Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,398, issued on April 14, was assigned to The Regents of the University of Colorado, a body corporate (Denver). "Self-healable, recyclable,... Read More

US Patent Issued to Sumitomo Electric Industries on April 14 for "Substrate for printed wiring board and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,399, issued on April 14, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan). "Substrate for printed wiring board and printed... Read More

US Patent Issued to Sumitomo Electric Industries on April 14 for "Substrate for printed wiring board and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,399, issued on April 14, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan). "Substrate for printed wiring board and printed... Read More

US Patent Issued to CISCO TECHNOLOGY on April 14 for "Via and pad arrangement for printed circuit board" (Chinese, American Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,400, issued on April 14, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.). "Via and pad arrangement for printed circuit board" was... Read More

US Patent Issued to CISCO TECHNOLOGY on April 14 for "Via and pad arrangement for printed circuit board" (Chinese, American Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,400, issued on April 14, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.). "Via and pad arrangement for printed circuit board" was... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Film package and package module including the same" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,401, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Film package and package module including ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Film package and package module including the same" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,401, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Film package and package module including ... Read More

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