US Patent Issued to Sumitomo Electric Industries on April 14 for "Substrate for printed wiring board and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,399, issued on April 14, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan).

"Substrate for printed wiring board and printed wiring board" was invented by Takuto Hidani (Osaka, Japan), Katsunari Mikage (Osaka, Japan) and Kenta Imakita (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate for a printed wiring board comprises: a base film having a first main surface and a second main surface; a first conductive layer disposed on the first main surface; a second conductive layer disposed on the second main surface; a first electroless copper plating layer disposed on the first conductive layer; a second electroless cop...