US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Film package and package module including the same" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,401, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Film package and package module including the same" was invented by Youngbae Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film package includes a film substrate extending in a first direction and including a first side and a second side facing each other, the film substrate including a device region between the first side and the second side, and the film substrate including a reinforcing region adjacent to at least one side of the device region in a second direction, the second direction intersecting the first direction. T...