Japan, April 1 -- NIKON CORP has got intellectual property rights for 'SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD.' Other related details are as follows:

Application Number: JP,2025-002606

Category (FI): H01L21/02@B,H10P10/00@A,H10P10/00@F

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Jan. 8, 2025

Publication Date: April 10, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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