Japan, April 1 -- NIKON CORP has got intellectual property rights for 'SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD.' Other related details are as follows:
Application Number: JP,2025-002606
Category (FI): H01L21/02@B,H10P10/00@A,H10P10/00@F
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 8, 2025
Publication Date: April 10, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....