India, April 23 -- TSMC held its earnings call, with its response closely watched amid rising industry interest in rival Intel's advanced packaging technologies, including EMIB.

In response, according to TechNews, TSMC Chairman and CEO C.C. Wei states that the company continues to offer the industry's largest reticle-size packaging solutions and, together with SoIC (System-on-Integrated-Chips), is confident in providing customers with the best options.

On its current packaging strategy, TSMC states that its primary advanced packaging approach is CoWoS. According to TechNews, citing institutional investors, TSMC's CoWoS capacity is expected to reach around 115,000 to 140,000 wafers per month by the end of 2026, and further increase to ap...