India, Aug. 18 -- TSMC is reportedly looking to accelerate its advanced packaging expansion by securing existing manufacturing infrastructure near its key production hubs.

According to Economic Daily News, sources say TSMC plans to acquire AUO's L7 and L5C fabs near its Central Taiwan Science Park facilities to expand advanced packaging capacity. The two fabs are reportedly under negotiation, though no agreement has been signed or officially announced.

The reported transaction is estimated to exceed TWD 30 billion, which would make it the largest sale of older-generation fabs by a Taiwanese panel maker in recent years.

As the report indicates, advanced packaging is moving toward a shift "from round to square," with traditional round si...