India, June 26 -- TSMC is set to go head-to-head with Samsung Electronics using "panel-level packaging (PLP)," a next-generation semiconductor packaging technology.

PLP can significantly improve the productivity of AI chip manufacturing, and with TSMC hurrying to ready mass production, a contest for leadership with Samsung Electronics-which entered the market first-looks inevitable.

According to industry sources, TSMC is building out a materials, components, and equipment (MCE) supply chain to establish its PLP mass-production system. It is currently in discussions with domestic and overseas MCE companies on equipment investment. TSMC is reported to be planning to begin PLP mass production as early as next year, and this is read as a mo...