India, April 22 -- TSMC held its earnings call, with tightness at its 3nm node coming into focus as the foundry giant outlines new plans to expand N3 capacity. Its Chairman and CEO C.C. Wei says that, historically, TSMC does not add capacity once a node reaches its target level; however, in response to strong AI-driven demand from customers, the company is increasing its capex to expand N3 capacity.

Wei says the company is executing a global capacity plan to support robust multi-year demand for 3-nanometer technologies, which are used across smartphones, HPC, AI (including HBM base dies), automotive, and IoT applications.

In Taiwan, TSMC plans to add a new 3nm fab to its GigaFab cluster in Tainan Science Park, with volume production sch...