India, July 13 -- TSMC is facing a surge in AI chip orders using its advanced packaging technology, such as CoWoS, but competitors such as Intel are benefiting as the Taiwanese semiconductor powerhouse is unable to keep up with demand.

AI and HPC chip demand has reached an unprecedented level, and the chips that are being built are based on some of the most advanced packaging technologies that the world has ever seen.

Leading this advanced packaging race is none other than TSMC, whose CoWoS (Chip-on-Wafer-on-Substrate) had a head start over the competition and has been the go-to choice for several years. As demand shoots through the roof, even the Taiwanese giant is facing the brunt of existing bottlenecks within the supply chain and is...