India, Sept. 29 -- The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing power into a smaller space in the future, industry leaders are therefore investing in new substrate technologies such as glass substrates.

These enable more functions to be integrated into a smaller space and allow data to be transmitted faster and more efficiently within the chip. To achieve this, however, manufacturers must drill millions of microscopic holes into the glass and then coat them with conductive material.

Millions of through-holes must be error-free

TRUMPF has now developed the first industrial process of its kind that enables the production of such structures with high quality and reproducible results. Wi...