India, Oct. 15 -- TOPPAN Inc., a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc., has established a production site for Flip Chip-Ball Grid Array (FC-BGA) substrates, high-density semiconductor packages, at Advanced Substrate Technologies Pte Ltd (AST) in the Republic of Singapore.

This plant marks TOPPAN's first overseas production facility for FC-BGA substrates, supported by the Singapore Economic Development Board (EDB) and Broadcom Inc., a leading provider of semiconductors for telecoms.

With the widespread adoption of generative AI and data centers, data traffic volumes have skyrocketed, leading to a rapid global increase in demand for cutting-edge FC-BGA substrates to support this growth. Within that growi...