India, April 23 -- Synopsys Inc. announced major advances in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC's most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16 with Super Power Rail and A14.

By unifying intelligent digital, analog, and verification flows, advanced 3D multi-die design, and optical-to-electrical design capabilities, Synopsys helps engineers improve quality of multiphysics results and accelerate development cycles from silicon to systems for increasingly complex AI and high-performance computing designs.

"TSMC's most advanced process and packaging technologies are opening new frontiers for performance, bandwidth, and energy effi...