India, Oct. 5 -- Synopsys announced new innovations with TSMC that accelerate the development of next-generation AI, high-performance computing (HPC), and advanced semiconductor systems.

Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity while accelerating adoption of TSMC's latest process and advanced packaging technologies.

"As AI systems continue to grow in scale and complexity, customers require proven IP, intelligent design solutions, and advanced packaging methodologies that work together seamlessly," said Michael Buehler-Garcia, Senior VP at Synopsys. "Our joint inn...