India, May 25 -- SK hynix is reportedly exploring cooperation with Intel in advanced 2.5D packaging, a move that could signal potential shifts in the AI chip packaging supply chain.

According to ZDNet, sources say SK hynix is conducting R&D on Intel's EMIB-based 2.5D packaging technology using its own HBM, while also reviewing related materials and component suppliers for future mass production. The company is reportedly testing the integration of HBM and logic semiconductors using EMIB-integrated substrates supplied by Intel.

Currently, as the report notes, the global 2.5D packaging supply chain is dominated by TSMC, with SK hynix maintaining a close partnership with TSMC on HBM and 2.5D packaging R&D. The report adds that TSMC's CoWoS...