India, May 27 -- Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.

This collaboration grants companies accepted into the Chips JU program access to Siemens' cutting-edge electronic design automation (EDA) software under pre-defined pricing and conditions.

"The agreement significantly lowers barriers for smaller companies, startups and research institutions to access world-class design, verification and manufacturing software - the same powerful tools us...