India, May 28 -- SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, has announced the availability of a new industry research report focused on the glass core substrate market and trends, produced in collaboration with Global Net Corp. (GNC).

The Glass Core Substrate Market and Development Trends Report examines the emerging market for glass core substrates, a potential next-generation packaging technology attracting increased attention as AI and high-performance computing (HPC) drive demand for larger and more advanced semiconductor packages.

"As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become ...