India, April 13 -- Semiconductor giants are accelerating global advanced packaging expansion as demand for AI chips surges, with Southeast Asia emerging as one of the most sought-after hubs.

While Intel is set to bring its advanced packaging facility in Malaysia online later this year, Bloomberg reports that Samsung is also preparing a major push in Vietnam, planning a US$4 billion (RM15.93 billion) investment to build a chip packaging plant in the country's north.

Notably, Global Economic News, citing Vietnamese outlet Soha, reports that another chip packaging player, Amkor Technology, is also accelerating the expansion in Vietnam, while working with local authorities to develop plans and policies, prioritizing liquefied petroleum gas ...