India, Oct. 23 -- Samsung Electro-Mechanics has signed a long-term supply agreement (LTA) worth KRW 360.5 billion for 'Memory Semiconductor Package Substrates' with a global major corporation.

Under this agreement, Samsung Electro-Mechanics will reliably supply high-performance package substrates used in memory semiconductors to a global major customer for one year, from January 1, 2027 to December 31, 2027.

A package substrate is a core component that connects the semiconductor chip to the main board, transmits electrical signals, and supports the stable operation of the semiconductor. In particular, package substrates applied to high-performance semiconductors must support large-capacity data processing and high-speed signal transmiss...