India, Oct. 21 -- When the European semiconductor industry gathers at SEMICON Europe in Munich from Nov. 10-13, 2026, Plasmatreat will demonstrate at Booth 567 in Hall C1 how surfaces can be specifically tailored to meet the requirements of subsequent manufacturing steps.

Whether it's die attach, wire bonding, hybrid bonding, TCB, underfill, molding, or encapsulation processes: Controlled surface conditions that reliably support wetting, adhesion, contact formation, and long-term reliability are crucial for consistent results.

To achieve this, Plasmatreat combines various plasma processes to remove organic residues, reduce oxide layers, improve wetting and adhesion, or specifically tailor surface properties for subsequent manufacturing ...