India, Nov. 10 -- Paras Semiconductors, a subsidiary of Paras Defence & Space Technologies Ltd, announced a strategic technology partnership with BroadPak Corp., USA, to accelerate the development of advanced semiconductor packaging capabilities in India.

The collaboration will combine Paras's manufacturing ambitions in Opto-electronics, photonics and co-packaged optics high with BroadPak's specialized technology expertise in advanced semiconductor packaging, heterogeneous integration and chiplet-based system architectures.

Through this partnership, Paras Semiconductors aims to establish an advanced heterogeneous integration and 3D packaging OSAT (Outsourced Semiconductor Assembly and Test) facility in India. The proposed facility will ...